Renhe road Beijing city Changping District machikou town head Industrial Park No. 2
Tel:
15811045199
13701279806
Fax:
010-88550708
Electronic Packaging Materials
Your location: Home >> Case >> Electronic Packaging Materials
Substrate
and thermal sink for power devices: it can be an alternative of oxygen-free
copper to increase the reliability of power devices like IGBT and MOSFET .
Printed
circuit board chipware: reduce thermal fatigue and shake fatigue, improve thermal
dissipation and performance, and reduce weight.
Heat sink
and cover plate of microprocessor: replace W-Cu and Mo-Cu, reduce cost and
weight, and improve machinability.
LED chip
substrate: large market potential.
Substrate
and shell of electronic devices: decrease weight by 45%-50% and improve
dimension stability.
LQ Material Technology Co.
Beijing ICP prepared No. 05083982
Address: Renhe road Beijing city Changping District machikou town head Industrial Park No. 2 Tel: 010-88550612 / 010-88550613 Fax: 010-88550708 E-mail: fanfan.sun@lq-mat.com
Online message
Facebook
Instagram