A new generation of composite panels for Electronic Packaging come out

LQ adoption of new technology independently developed thin (0.3-0.5mm) LD1501 new Al / SiC composite panels, it has a low density, low thermal expansion and high thermal conductivity characteristics, but also with ordinary cutting tools, the area size and thickness can be changed according to customer requirements. As a high-quality electronic packaging materials, thermal management materials for electronic devices, especially for aerospace, microwave integrated circuits, power modules, military radio systems and other fields.