With the development of microelectronic products tends to diversify functions, high performance and miniaturization, especially the development of 5G communication technology requires communication equipment (network base station, large filter) to have higher power, ceramic substrate, with its excellent characteristics of low thermal resistance, high voltage resistance, high heat dissipation and long service life, has a very wide application prospect in the fields of high-power LED industry, high-frequency electronic equipment, large network base stations, filter components and so on. The surface metallization of ceramic substrate is an important prerequisite for its practical application because metal is the part connected with the working circuit, and tthe ,he effective bonding of the two can improve the performance of electronic products.

METALLIZATION OF CERAMICS, or METAL CLAD CERAMICS, is a basic electronic material made by directly sintering or depositing copper coating on ceramic surface with special technologies. Different from the existing ceramic metallization processes in the industry, Beijing Langqiao Material Technology Co., Ltd. (LQ) deposits copper on ceramic substrates by its innovative DSC (direct sprayed copper) process. By the DSC process, copper layer can be deposited from 100 to 2,000um or even thicker, which exhibits special heat dissipation performance.