As we all know, high temperature is the enemy of high-power electrical devices such as IGBT, LED, 5G equipment and integrated circuit. High temperature will not only lead to unstable operation of the system, shorten the service life, and even burn some parts. The heat causing high temperature does not come from the outside of the electrical equipment, but from the electrical parts with high-intensity operation inside the equipment. The function of radiator is to absorb this heat and then radiate it outside the equipment, so as to ensure the normal temperature and stable working state of electrical components. Most radiators absorb heat by contacting the surface of heating parts, and then transfer the heat to a distance through various methods.

The radiator systems made of air-cooled / water-cooled fins are the most used in the electronic field. The material of heat sink is metal or alloy with excellent thermal conductivity and therefore copper and aluminum are the common choice in the market. However, these two metals have their own advantages and disadvantages. Copper has good thermal conductivity, but the price is high, the processing is more complicated, the weight is too large (many pure copper radiators exceed the weight limit of CPU), the heat capacity is small, and it is easy to oxidize. Pure aluminum is too soft to be used directly. Only aluminum alloy can provide sufficient hardness. Aluminum alloy has the advantages of low price and light weight, but its thermal conductivity is much worse than copper. It cannot dissipate heat as quickly as copper, so for the heat sink made by aluminum it has to increase the heat dissipation area or the height of needle fin, as a result, cannot be accepted by the market because of the costs high up.

Considering the respective disadvantages of copper and aluminum, some high-end radiators in the market now adopt the manufacturing process to combine copper and aluminum together. These heat sinks usually adopt copper metal base, while the heat sink fins adopt aluminum alloy, or aluminum as base, overlay copper on it. At present, common copper aluminum bonding processes include brazing, patch, screw locking, copper plug, copper inlay, etc. However, these methods cannot achieve a comprehensive and firm combination on the contact surface of copper and aluminum. The most commonly used brazing process has been proved that not only the implementation process is complex, but also the brazing material is easy to corrode, resulting in poor heat dissipation effect.

LQ Technology applies DSC (direct spray copper) process to deposit copper directly on the surface of aluminum substrate, with a contact area of 99.5% and a bonding strength of more than 100MPa. According to the tests of institutions, the heat dissipation performance of aluminum pin fin radiator coated with copper by DSC process can have 2.1 times that of brazing.

LQ Technology uses its proprietary technology to deposit porous materials on the needle fin surface of the forged radiator, to further expand the heat dissipation area by 2-3 times so as to further improve the heat dissipation performance.